LMPA^™

Reduce production costs

• 20%-25% lower electricity bills

  Because of the lower process temperatures, soldering with LMPA^™-Q will reduce electricity consumption in between 20%-25% compared to Sn(Ag)Cu alloys.

  SAC

  LMPA^™

  22% less electricity

• 95% less wasted alloys

  Due to its low oxidation behavior LMPA^™-Q will produce 95% less dross in wave soldering without nitrogen compared to Sn(Ag)Cu.

  SAC

  LMPA^™

  95% less waste

• Soldering without nitrogen

  Nitrogen is often used for cooling, to prevent boards and components from overheating. With LMPA^™-Q you will no longer need nitrogen during wave and reflow soldering.

  SAC

  LMPA^™

  No nitrogen

• Lower alloy cost

  LMPA^™-Q does not contain silver (Ag). This can significantly lower the alloy cost up to 40%.

  SAC

  LMPA^™

  40% cheaper alloy

• Higher first pass yields

  Soldering with the LMPA^™-Q alloy can substantially increase first pass yields, especially on electronic units with heavy thermal mass.

  Reduce repair costs

• Eliminate heat-related failures

  The lower soldering temperatures of the LMPA^™-Q alloy will virtually eliminate heat-related board and component failures and allow the use of lower cost materials

  Reduce material cost