What are LMPA?
LMPA™
LMPA is short for Low Melting Point Alloys™. These alloys allow you to use soldering temperatures that are considerably lower than for the traditional lead-free Sn(Ag)Cu (SAC) alloys.
LMPA-Q™
What LMPA-Q will allow you to do
- Solder at lower temperatures between 190ºC and 250ºC
- Solder 5 times faster with zero defects
- Reduce voiding below 10%
- Reduce production costs
- Increase production line capacity
- Reduce your carbon footprint
- Avoid heat-related board and component failures
- No more need for nitrogen
- Eliminate dross formation (oxides)
- Excellent wetting
For all soldering processes
LMPA™-Q can be used for all soldering processes:

Wave soldering
LMPA-Q: 200°C - 230°C
Sn(Ag)Cu: 260°C - 280°C

Selective soldering
LMPA-Q: 200°C - 250°C
Sn(Ag)Cu: 270°C - 320°C

Reflow soldering
LMPA-Q: 190°C - 220°C
Sn(Ag)Cu: 235°C - 250°C