What are LMPA?

LMPA^™

LMPA is short for Low Melting Point Alloys^™. These alloys allow you to use soldering temperatures that are considerably lower than for the traditional lead-free Sn(Ag)Cu (SAC) alloys.

LMPA-Q^™

LMPA-Q^™ is an enhanced LMPA^™ with superior mechanical properties. It's without exception the best alloy we have developed so far. The benefits are numerous.

What LMPA-Q will allow you to do

Solder at lower temperatures between 190ºC and 250ºC
Solder 5 times faster with zero defects
Reduce voiding below 10%
Reduce production costs
Increase production line capacity
Reduce your carbon footprint
Avoid heat-related board and component failures
No more need for nitrogen
Eliminate dross formation (oxides)
Excellent wetting

For all soldering processes

LMPA^™-Q can be used for all soldering processes:

Wave soldering

LMPA-Q: 200°C - 230°C

Sn(Ag)Cu: 260°C - 280°C

Selective soldering

LMPA-Q: 200°C - 250°C

Sn(Ag)Cu: 270°C - 320°C

Reflow soldering

LMPA-Q: 190°C - 220°C

Sn(Ag)Cu: 235°C - 250°C