5 times faster soldering
with zero defect
LMPA™-Q allows for up to 5 times faster production speeds than Sn(Ag)Cu alloys in combination with lower preheat and soldering temperatures. LMPA-Q provides easy through hole wetting on thermally heavy components and all finishings including OSP. Moreover, the low oxydation and bridging behaviour of LMPA-Q will facilitate a zero defect process.