5 times faster soldering with zero defect

LMPA-Q allows for up to 5 times faster production speeds than Sn(Ag)Cu alloys in combination with lower preheat and soldering temperatures. LMPA-Q provides easy through hole wetting on thermally heavy components and all finishings including OSP. Moreover, the low oxydation and bridging behaviour of LMPA-Q will facilitate a zero defect process.

Sn(Ag)Cu alloys are typically limited to speeds of 5mm/s to avoid defects

LMPA can solder at speeds up to 30mm/s with zero defect

Your browser is out-of-date!

Update your browser to view this website correctly. Update my browser now

×