Drastically reduce solder voiding

Void formation under components with large soldering planes and low stand-off heights, such as QFN components, is a well-known phenomenon. These air pockets can reduce mechanical strength as well electrical and thermal conductivity.

For Sn(Ag)Cu-based alloys, voiding levels are typically in between 10% and 35%.

With the LMPA-Q alloy voiding levels can be reduced to between 1% and 10%.

Need more info?

Sn(Ag)Cu voiding 10% to 35%

solder voiding on a QFN component soldered with SAC

LMPAvoiding 1% to 10%

solder voiding on a QFN component soldered with SAC
Your browser is out-of-date!

Update your browser to view this website correctly. Update my browser now

×