Avoid heat related board and component failures
Current lead-free soldering temperatures can damage or predamage temperature sensitive components and PCB board materials. Furthermore they can also cause a shift in the properties of some components which can impact the functionality of sensitive electronic circuits.
Affected components can for example be: Capacitors, BGAs, LGAs, fuses, displays, crystal oscillators, LEDs, displays, components with a plastic body, coils and transformers,...
The LMPA-™Q low melting point alloy allows for lower soldering temperatures and virtually eliminates the risk on damage by thermal stress, facilitating the use of temperature sensitive components and PCB board materials.