Avoid heat related board and component failures

Current lead-free soldering temperatures can damage or predamage temperature sensitive components and PCB board materials. Furthermore they can also cause a shift in the properties of some components which can impact the functionality of sensitive electronic circuits.

Affected components can for example be: Capacitors, BGAs, LGAs, fuses, displays, crystal oscillators, LEDs, displays, components with a plastic body, coils and transformers,...

The LMPA-Q low melting point alloy allows for lower soldering temperatures and virtually eliminates the risk on damage by thermal stress, facilitating the use of temperature sensitive components and PCB board materials.

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